Vanguard Group has been granted a patent for a semiconductor device with a unique inter-metal dielectric layer design. The device includes multiple metal layers with round corners and dielectric layers with varying stress values and thicknesses. This innovation aims to improve the performance and reliability of semiconductor devices. GlobalData’s report on Vanguard Group gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Vanguard Group, Retail trading platforms was a key innovation area identified from patents. Vanguard Group's grant share as of April 2024 was 84%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with specific stress values and layer thicknesses
A recently granted patent (Publication Number: US11973021B2) discloses a semiconductor device with unique features aimed at improving performance and reliability. The device includes a first metal layer, a second metal layer, and an inter-metal dielectric layer with specific characteristics. The inter-metal dielectric layer consists of three dielectric layers with varying stress values and thicknesses, providing enhanced structural integrity. Additionally, the device features round corners with a specific radius of curvature, contributing to the overall design and functionality.
Furthermore, the patent details a method for forming the semiconductor device, involving specific deposition techniques and processes to achieve the desired structure. The method includes steps such as conformally depositing dielectric layers with different stress values, utilizing specific deposition methods, and forming the metal layers with round corners. The method also emphasizes the importance of planarizing the dielectric layers and utilizing different power consumption levels for deposition. Overall, the patent highlights innovative approaches to semiconductor device design and fabrication, aiming to enhance performance and reliability in electronic applications.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
