China Pacific Insurance (Group) has been granted a patent for a semiconductor device with an innovative assembly process. The device includes a conductive post, molding compound sheet, electrical circuit patterns, and encapsulants. This technology enhances the efficiency and performance of semiconductor packages. GlobalData’s report on China Pacific Insurance (Group) gives a 360-degree view of the company including its patenting strategy. Buy the report here.

According to GlobalData’s company profile on China Pacific Insurance (Group), Digital lending was a key innovation area identified from patents. China Pacific Insurance (Group)'s grant share as of February 2024 was 67%. Grant share is based on the ratio of number of grants to total number of patents.

Semiconductor device with conductive post, electrical circuit patterns

Source: United States Patent and Trademark Office (USPTO). Credit: China Pacific Insurance (Group) Co Ltd

A recently granted patent (Publication Number: US11923260B2) discloses a semiconductor device comprising an electrical component assembly, a conductive post, a molding compound sheet serving as a first encapsulant, a first electrical circuit pattern, a second encapsulant, and a conductive layer. The conductive layer is formed over the second encapsulant and within openings in both the second encapsulant and the first encapsulant, extending to the conductive post. The device may also include additional features such as an electrical component within the assembly, a shielding layer, and a semiconductor package.

Another aspect of the patent describes a semiconductor device with a substrate, multiple electrical components, a conductive post, a molding compound sheet as the first encapsulant, a first electrical circuit pattern, a second encapsulant, and a conductive layer. The conductive layer can be designed as a second electrical circuit pattern over the second encapsulant. Additionally, the device may feature a shielding layer over the electrical components and a semiconductor package over the first electrical circuit pattern. The first electrical circuit pattern extends over at least one of the electrical components, showcasing the versatility and complexity of the semiconductor device as outlined in the patent claims.

To know more about GlobalData’s detailed insights on China Pacific Insurance (Group), buy the report here.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.