China Pacific Insurance (Group) has filed a patent for a semiconductor device that includes a substrate with a land grid array, a component placed over the substrate, and an encapsulant covering the component. The land grid array remains outside the encapsulant. A fanged metal mask is positioned over the land grid array, and a shielding layer is formed over the semiconductor package and fanged metal mask. The fanged metal mask is removed after the shielding layer is formed. GlobalData’s report on China Pacific Insurance (Group) gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on China Pacific Insurance (Group), digital lending was a key innovation area identified from patents. China Pacific Insurance (Group)'s grant share as of June 2023 was 1%. Grant share is based on the ratio of number of grants to total number of patents.
Semiconductor device with fanged metal mask for shielding
A recently filed patent (Publication Number: US20230207485A1) describes a semiconductor device with unique features. The device includes a semiconductor package with a substrate, a component, and an encapsulant. The substrate has a land grid array located outside the encapsulant. A fanged metal mask is positioned over the land grid array, with two fangs extending towards the encapsulant. A shielding layer is formed over the semiconductor package and the fanged metal mask.
The patent claims also describe various shapes for the fangs, including rectangular, trapezoidal, and triangular shapes. The shape of the fangs is designed to create a straight borderline for the shielding layer. Additionally, the patent mentions the use of a carrier, where the semiconductor package and fanged metal mask are directly placed on the carrier.
Another aspect of the semiconductor device described in the patent is a fanged mask that is disposed over a portion of the substrate, with the shielding layer formed in the gap between the fanged mask and the encapsulant. The fanged mask includes a pair of fangs, which can have a rectangular shape in plan view. The fanged mask may also have a curved transition between each fang and its front surface. The shape of the fangs is configured to produce an approximately straight borderline for the shielding layer.
In summary, the patent describes a semiconductor device with a unique fanged metal mask and shielding layer configuration. The fanged metal mask is positioned over the land grid array and can have various shapes, such as rectangular or trapezoidal. The shielding layer is formed over the semiconductor package and the fanged metal mask, creating a straight borderline. The patent also mentions the use of a carrier for the semiconductor package and fanged metal mask. This innovative design aims to improve the performance and functionality of semiconductor devices.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
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